Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2002-11-18
2004-03-23
Niebling, John (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S686000
Reexamination Certificate
active
06710445
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a coplanarity inspection system of a package and a method thereof.
2. Description of the Background Art
A surface mounting apparatus comprises a base frame, an X-Y gantry, a head unit, a printed circuit board and a components supplying device. The X-Y gantry is assembled on the base frame and make the head unit move toward directions of X-Y shafts. The head unit being moved by the X-Y gantry picks up a component supplied from the components supplying device and then mounts the components to the printed circuit board transferred to a components mounting position. The printed circuit board mounted the components is transferred to the components mounting position by a transfer device of the printed circuit board.
The construction of the surface mounting apparatus being used for mounting the components to the printed circuit board
1
will be described in detail with reference to the accompanying drawings.
FIG. 1
is a perspective view of a surface mounting apparatus in accordance with a conventional art and
FIG. 2
is a plane view of a surface mounting apparatus of FIG.
1
. As shown in
FIGS. 1 and 2
, the surface mounting apparatus
10
comprises a base frame
11
, an X-Y gantry
12
, plural head units
13
and
14
, a printed circuit board transfer device
15
and a components supplying device
16
.
The X-Y gantry
12
installed to a plane of the base frame
11
comprises a Y-shaft stator's frame
12
a
, a Y-shaft permanent magnet
12
b
, a Y-shaft rotator
12
c
, an X-shaft stator's frame
12
d
, an X-shaft permanent magnet
12
e
, an X-shaft rotator
12
g
. The Y-shaft permanent magnets
12
b
comprise a plurality of N and S polarities and are assembled to the inside wall of the Y-shaft stator's frame
12
a
and the X-shaft permanent magnets
12
e
comprise a plurality of N and S polarities and are assembled to the inside wall of the X-shaft stator's frame
12
a
. The Y-shaft rotator
12
c
is assembled to the inside of the Y-shaft stator's frame
12
a
assembled the Y-shaft permanent magnets
12
b
and the X-shaft rotator
12
g
is assembled to the inside of the X-shaft stator's frame
12
d.
A back plate
12
f
is installed to the plane of the X-shaft rotator
12
g
and a first head unit
13
among plural head units
13
and
14
is installed to the plane of the back plate
12
f
. When an electrical signal is supplied to the X-shaft rotator
12
g
from the external, the first head unit
13
assembled to the plane of the back plate
12
f
is moved toward the direction of the X-shaft by the trust generated between the X-shaft rotator
12
g
and the X-shaft permanent magnet
12
e
. Here, the X-shaft rotator
12
g
comprises a plurality of armature coils (not shown). For making the first head unit
13
move toward the direction of the Y-shaft, the X-shaft stator's frame
12
d
is moved toward the direction of the Y-shaft.
For making the X-shaft stator's frame
12
d
move toward the direction of the Y-shaft, the X-shaft stator's frame
12
d
is formed integrally with the Y-shaft rotator
12
c
. The Y-shaft rotator
12
c
formed integrally with the X-shaft stator's frame
12
d
is assembled to the inside of the Y-shaft stator's frame
12
a
and when an electrical signal is supplied to the plurality of armature coils (not shown) assembled to the Y-shaft rotator
12
c
, a trust is generated between the armature coil and Y-shaft permanent magnet
12
b
, so the Y-shaft rotator
12
c
is moved toward the direction of the Y-shaft by the trust.
According to the movement of the Y-shaft rotator
12
c
, the X-shaft stator's frame formed integrally with the Y-shaft rotator
12
c
is moved toward the direction of the Y-shaft and so the first head unit
13
is moved toward the direction of the Y-shaft. With the same of the first head unit
13
moving toward directions of the X-Y shafts, the second unit
14
of the plural head units
13
and
14
is moved toward directions of the X-Y shafts with the same as the method in the first head unit
13
. The first head unit
13
and the second head unit
14
moving toward the directions of the X-Y shafts mount the components to the printed circuit board transferred by the printed circuit board transfer device
15
.
For mounting the components to the printed circuit board
1
by using the first and second head units
13
and
14
, the first and second head units
13
and
14
first suck the components. The components are mounted to the components supplying device
16
with a state of a tape reel (not shown). The components supplied from the tape reel mounted to the components supplying device
16
is transferred and mounted to the printed circuit board
1
by the first and second head units
13
and
14
.
For mounting the components to the printed circuit board
1
by the plural first and second head units
13
and
14
, a position for mounting the components in the printed circuit board is first sensed. For this, a vision camera
17
is used. As shown in
FIG. 2
, the vision camera
17
is fixedly installed to a side of the head unit
14
for sensing the position of the components and moved simultaneously when moving the head unit
14
, thereby sensing the position for mounting the components to the printed circuit board
1
.
That is, the head unit installed to the X-Y gantry
12
performs picking of the components (electronic components) from the components supplying device
16
and the vision inspection through the vision camera
17
is also performed and thereafter the placing of the components is performed to the printed circuit board
1
positioned on a conveyor. As shown in
FIGS. 4 and 5
, the components
20
comprises a body
21
and a plurality of leads
22
arranged around the body
21
, and the lead
22
comprises a protrusion portion
22
a
curved horizontally from the package body
21
, an inclination portion
22
b
extended with slant of a predetermined angle downwardly from the protrusion portion
22
a
, and a pin portion
22
c
curved extendedly again horizontally from the inclination portion
22
b.
When the leads
22
are mounted to the printed circuit board
1
, in a case that an alignment state including position or direction, width and high and low satisfies the regulated conditions, an exact contact state can be obtained. However, if the above regulated conditions are not satisfied, there occurs a problem: when mounting the package to the printed circuit board
1
, the lead
22
comes off the printed circuit board
1
and so a proper soldering can not be performed, so that it stands in a casual relation in badness of the components. That is, there is a problem that when mounting the components
2
, the coplanarity of the components, as the cause of the badness of the components, can not be confirmed.
SUMMARY OF THE INVENTION
Accordingly, it is a primary object of the present invention to solve the above problems.
Another object of the present invention is to provide a coplanarity inspection system of a package in which an error on an X-Y gantry is inspected and corrected by using a vision apparatus, and simultaneously the coplanarity of the components is inspected and corrected by a coplanarity inspection apparatus, and then the components is mounted, thereby capable of performing smoothly the components mounting work without a badness of the components.
In one aspect of the present invention, to achieve the above-described objects of the invention, in a surface mounting device for picking the electronic components from an electronic component feeding apparatus and then placing the components to a printed circuit board, the surface mounting device comprises: a vision apparatus including a head unit for picking an electronic component from a head and a camera for inspecting a position and an alignment state of the electronic components; a laser sensor including a light receiving part and a light emitting part for inspecting the coplanarity of the electronic components; a controller
Kim Jong Hong
Oh Tae Seok
Fleshner & Kim LLP
Mirae Corporation
Niebling John
Stevenson Andre′
LandOfFree
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