Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-09-30
1994-04-19
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165185, 174 163, 257719, 257727, 361690, H05K 720
Patent
active
053051858
ABSTRACT:
There is provided a method and materials for cooling the power train components, such as transformers, rectifiers, chokes, and the like, of an integrated on-board power supply IOP) using a single heatsink. Spacers are positioned between the power train components and a substrate, the substrate for mounting the components. The spacers are individually dimensioned and shaped to raise the heat-removal surfaces of the components to a substantially uniform and minimal height. A heatsink having a substantially planar, heat-acquiring surface is positioned on the heat-removal surfaces of the power train components. Fasteners are used to compress the spacers, urging the components against the heatsink to provide a substantially continuous and coplanar thermal interface between the components and the heatsink. After the components, heat sink and substrate have been fastened to each other, the components are electrically connected to the substrate by soldering.
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DeCarolis Joseph A.
Norris Steve W.
Patel Raoji
Piche Gerald J.
Samarov Victor M.
Cefalo Albert P.
Hudgens Ronald C.
Thompson Gregory D.
Young Barry
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