Coplanar die to substrate bond method

Details Coplanar die to substrate bond method Coplanar die to substrate bond method

1987-03-13

1988-12-20

Walton, Donald L.

Fishing, trapping, and vermin destroying

437235, 357 81, H01L 2156, H01L 2160

Patent

active

047925337

ABSTRACT:
A method for bonding die to substrates coplanarly in a multichip module assembly. After the die are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the die and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressed and cured on the surface of the die and substrate. This film is used as a base for interconnect lines.

REFERENCES:
patent: 3909332 (1975-09-01), Yerman
patent: 4017886 (1977-04-01), Tomono et al.
patent: 4630096 (1986-12-01), Drye et al.
patent: 4722914 (1988-02-01), Drye et al.

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