Computer graphics processing and selective visual display system – Display peripheral interface input device – Touch panel
Reexamination Certificate
1999-06-30
2001-10-16
Jankus, Almis R. (Department: 2675)
Computer graphics processing and selective visual display system
Display peripheral interface input device
Touch panel
C345S179000, C345S178000, C178S018010
Reexamination Certificate
active
06304251
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a coordinate input device wherein an operation area is operated by means of an input member such as an input pen to effect an input of data.
2. Description of the Related Art
A conventional coordinate input device will be described below with reference to
FIGS. 9
to
13
all concerned with a conventional coordinate input device, of which
FIG. 9
is a plan view of the device,
FIG. 10
is a sectional view taken on line
10
—
10
in
FIG. 9
,
FIG. 11
is a sectional view taken on line
11
—
11
in
FIG. 9
,
FIG. 12
is a plan view of a lower substrate, and
FIG. 13
is a rear view of a film substrate.
In the conventional coordinate input device, a lower substrate
21
formed of a transparent glass is provided with a rectangular body portion
21
a
and a terminal portion
21
b
formed in part of the body portion
21
a.
On the whole of one side (upper surface) of the lower substrate
21
is formed a first transparent resistance film
22
using indium oxide.
On the transparent resistance film
22
are formed a pair of first electrode portions
23
a
and
23
b
formed of silver for example and which are parallel to each other. Between the electrode portions
23
a
and
23
b
there is formed an operation area
24
in the direction of X axis.
As shown in
FIG. 12
, on the transparent resistance film
22
on the lower substrate
21
there are formed a pair of first lead-out electrodes
25
a
and
25
b
formed of silver for example and drawn out from the electrode portions
23
a
and
23
b
to the terminal portion
21
b
while keeping out of the operation area
24
and a pair of second lead-out electrode portions
26
a
and
26
b
formed of silver for example and extending from the terminal portion
21
b
to the body portion
21
a
in the vicinity of the terminal portion
21
b
, the lead-out electrode portions
26
a
and
26
b
being formed spacedly from and alternately with the lead-out electrode portions
25
a
nd
25
b.
In an exposed state of the electrode portions
23
a
,
23
b
and the operation area
24
, a first insulating film
27
is formed on the transparent resistance film
22
and also on the first and second lead-out electrode portions
25
a
,
25
b
,
26
a
,
26
b
, the insulating film
27
being cut out at end portions of the second lead-out electrode portions
26
a
and
26
b
to give exposed portions
28
a
and
28
b.
As shown in
FIGS. 10
,
11
and
13
, a second transparent resistance film
30
is formed using indium oxide on the whole of one side (lower surface) of an upper film substrate
29
, the upper film substrate
29
being formed of a transparent synthetic resin, and a pair of second electrode portions
31
a
and
31
b
formed of silver for example and parallel to each other are formed on the transparent resistance film
30
on the film substrate
29
, with an operation area
32
being formed in the direction of Y axis between the electrode portions
31
a
and
31
b.
On the transparent resistance film
30
are formed a pair of third lead-out electrode portions
33
a
and
33
b
formed of silver for example, the electrode portions
33
a
and
33
b
being drawn out in L shape from the electrode portions
31
a
and
31
b
while keeping out of the operation area
32
With the electrode portions
31
a
,
31
b
and the operation area
32
exposed, a second insulating film
34
is formed on the transparent resistance film
30
and also on the third lead-out electrode portions
33
a
,
33
b
, the insulating film
34
being cut out at end portions of the third lead-out electrode portions
33
a
and
33
b
to give exposed portions
35
a
and
35
b
. When the film substrate
29
is superimposed on the lower substrate
21
, the exposed portions
35
a
and
35
b
become opposed to the exposed portions
28
a
and
28
b.
As shown in
FIG.11
, an electrically conductive adhesive
36
which comprises a thermosetting or thermoplastic resin with electrically conductive particles such as silver particles is applied between the exposed portions
28
a
,
28
b
and the exposed portions
35
a
,
35
b
. With the electrically conductive adhesive
36
, the electrode portions
31
a
and
31
b
are drawn out electrically to the second lead-out electrode portions
26
a
and
26
b.
As shown in
FIGS. 10 and 11
, dot spacers
37
are disposed between the first and second transparent resistance films
22
,
30
.
The electrically conductive adhesive
36
is applied to the second exposed portions
28
a
and
28
b
of the lower substrate
21
. If the film substrate
29
is superimposed on the lower substrate
21
through the dot spacers
37
, allowing the exposed portions
35
a
and
35
b
to come into opposition to the exposed portions
28
a
and
28
b
and if in this state heat and pressure are applied, the thermosetting resin will cure to bond the second lead-out electrode portions
26
a
,
26
b
and the third lead-out electrode portions
33
a
,
33
b
with each other and in this bonded state the second and third lead-out electrode portions will be electrically connected together through electrically conductive particles.
As shown in
FIG. 9
, a flat cable
38
, which is formed of a flexible synthetic resin, comprises a base portion
38
a
, a mounting portion
38
b
provided at an end of the base portion
38
a
, and a plurality of conductor portions
39
extending through both base portion
38
a
and mounting portion
38
b.
The flat cable
38
is disposed so that its conductor portions
39
are opposed to the first and second lead-out electrode portions
25
a
,
25
b
,
26
a
,
26
b
of the lower substrate
21
and are connected thereto using an electrically conductive adhesive (not shown).
The connection between the conductor portions
39
and the first and second lead-out electrode portions
25
a
,
25
b
,
26
a
,
26
b
is conducted by applying an electrically conductive adhesive onto those lead-out electrode portions, placing the conductor portions
39
thereon and applying heat and pressure.
Inputted data are extracted electrically from the coordinate input device through the flat cable
38
.
In operation, the film substrate
29
is pushed with an input member on its side opposite to the operation area
32
, thereby causing the film substrate
29
and the second transparent resistance film
30
to be deformed and allowing the transparent resistance film
30
to come into contact with the transparent resistance film
22
, whereby desired characters and patterns can be inputted. The data thus inputted are extracted from the first and second lead-out electrode portions
25
a
,
25
b
and
26
a
,
26
b
and are extracted to the exterior through the flat cable
38
.
In the conventional coordinate input device, the first and second lead-out electrode portions
25
a
,
25
b
,
26
a
,
26
b
provided on the lower substrate
21
and the conductor portions
39
of the flat cable
38
are connected together using an electrically conductive adhesive and so are between the third lead-out electrode portions
33
a
,
33
b
formed on the film substrate
29
and the second lead-out electrode portions
26
a
,
26
b
formed on the lower substrate
21
using the electrically conductive adhesive
36
. These connecting operations are troublesome, leading to low productivity and high cost.
Further, since the first and second lead-out electrode portions
25
a
,
25
b
and
26
a
,
26
b
are arranged in an alternate manner, the electrically conductive adhesive
36
cannot follow up a great difference in the amount of elongation caused by thermal expansion between the lower substrate
21
formed of glass and the film substrate
29
formed of a synthetic resin, thus giving rise to the problem that the electrically conductive adhesive
36
comes off and there occurs a defective connection
SUMMARY OF THE INVENTION
According to the first arrangement adopted by the present invention for solving the above-mentioned problems there is provided a coordinate input device comprising: a lower substrate having a first transpare
Ito Masaki
Shoya Hiroki
Uehara Masato
Yanagidate Tadashi
Alps Electric Co. ,Ltd.
Awad Amr
Brinks Hofer Gilson & Lione
Jankus Almis R.
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