Cooling technique for compact electronics inverter

Details Cooling technique for compact electronics inverter Cooling technique for compact electronics inverter

1986-12-22

1989-02-21

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510426, 361385, 357 82, H01L 2342, F28D 1502

Patent

active

048056910

ABSTRACT:
A substrate with a heat producing electronic component is mounted directly on a heat dissipating structure. The heat dissipating structure has a closed chamber with adjacent condenser and evaporator sections and contains a supply of liquid cooling fluid with a predetermined vaporization temperature. The evaporator section is in heat transfer relation with the substrate and the electronic component thereon. A plurality of channels are strategically arranged in the surfaces bounding the chamber to move the cooling fluid by capillary action in a predetermined path between the condenser and evaporator sections in heat exchange relationship over the chamber walls to maintain the substrate at an acceptable temperature. A heat sink, in heat exchange relationship with the condenser section of the heat dissipating structure, maintains a temperature differential between the evaporator and condenser sections and assures that the condenser section is cooled sufficiently to condense the cooling fluid.

REFERENCES:
patent: 3833753 (1974-09-01), Garboushian
patent: 3839660 (1974-10-01), Stryker
patent: 4019098 (1977-04-01), McCready et al.
patent: 4069497 (1978-01-01), Steidlitz
patent: 4168507 (1979-09-01), Yester, Jr.
patent: 4275510 (1981-06-01), George
patent: 4303934 (1981-12-01), Stitt
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4376287 (1983-03-01), Sechi
patent: 4398208 (1983-08-01), Murano
patent: 4524238 (1985-06-01), Butt
patent: 4567505 (1986-01-01), Pease et al.

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