Fluid reaction surfaces (i.e. – impellers) – With heating – cooling or thermal insulation means – Changing state mass within or fluid flow through working...
Patent
1983-02-01
1985-07-30
Scott, Samuel
Fluid reaction surfaces (i.e., impellers)
With heating, cooling or thermal insulation means
Changing state mass within or fluid flow through working...
416 97R, F01D 518
Patent
active
045318891
ABSTRACT:
An improved cooling system utilizes flow resistant devices distributing liquid coolant to air foil coolant channels in a bucket of a turbine. A separate flow resistance device associated with each of the air foil coolant channels resist the flow of liquid coolant into the coolant channels whereby a fluid head is developed in a standpipe upstream of the flow resistance devices. The fluid head, together with the outward radial acceleration meters the flow of fluid through each flow resistance device according to the head. In the disclosed embodiments, the flow resistant devices alternately take the form of a tortuous passage, an orifice and a plurality of vortex flow chambers.
REFERENCES:
patent: 2991973 (1961-07-01), Cole et al.
patent: 3411764 (1968-11-01), Allen
patent: 3658439 (1972-04-01), Kydd
patent: 3706508 (1972-12-01), Moskowitz
patent: 3804551 (1974-04-01), Moore
patent: 4017210 (1977-04-01), Darrow
patent: 4118145 (1975-10-01), Stahl
patent: 4212587 (1980-07-01), Horner
patent: 4242045 (1980-12-01), Grondahl
patent: 4244676 (1981-01-01), Grondahl
patent: 4267045 (1981-05-01), Hoof
patent: 4293275 (1981-10-01), Kobayashi et al.
patent: 4350473 (1982-12-01), Dakin
Bowman B.
General Electric Co.
Scott Samuel
Squillaro J. C.
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