Cooling system used with an electronic circuit device for coolin

Details Cooling system used with an electronic circuit device for coolin Cooling system used with an electronic circuit device for coolin

1991-11-01

1993-03-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 257714, H05K 720

Patent

active

051950200

ABSTRACT:
A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As the result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.

REFERENCES:
patent: 3896544 (1975-08-01), Fosnough
patent: 4226281 (1980-10-01), Chu
patent: 4644385 (1987-02-01), Nakanishi
patent: 4879632 (1989-11-01), Yamamoto et al.
Thermalloy, Inc., Semiconductor Accessories, "Thermal Compounds, Adhesives, and Mounting Kits".
Dow Corning, Information About Silicone Compounds, "Dow Corning 340 Heat Sink Compound".
American Oil and Supply Co., Technical Data Sheet--Product Bulletin No. No. 200, "PQ Heat Sink Compound".
Patent Abstracts of Japan, vol. 10, No. 275.
IBM Technical Disclosure Bulletin, vol. 29, No. 4, Sep. 1986, pp. 1469-1470, New York, US; "Thermal Grease Module Cap Designs".
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, pp. 4391-4392, New York, US; S. E. Greer et al.: "Modified Bellows Conductive Cooling".

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