Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1984-07-12
1985-12-24
Tolin, G. P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
357 82, 165 804, H05K 720
Patent
active
045610401
ABSTRACT:
A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a "cooling chip", in intimate contact with the back surface of an integrated circuit chip (in a "flip chip" configuration, the front, or circuit-implemented, surface, makes contact with a ceramic carrier or module); the cooling chip is provided with a plurality of spaced parallel grooves which extend along the one side or surface opposite the surface that is in bearing contact with the integrated circuit chip, whereby liquid coolant flows through the grooves so as to remove heat from the integrated circuit chip; further included in the system is a specially configured bellows for conducting the liquid coolant from a source to the heat-sink, and for removing the liquid coolant; a coolant distribution means, in the form of at least one glass plate or manifold, is provided with spaced passageways interconnecting the respective incoming and outgoing coolant flow paths of the bellows with the heat-sink.
REFERENCES:
patent: 3375855 (1968-04-01), Deeks
patent: 3649738 (1972-03-01), Anderson
patent: 4109680 (1978-08-01), Lavender
patent: 4138692 (1979-02-01), Meeker
patent: 4352373 (1982-10-01), Kay
patent: 4494171 (1985-01-01), Bland
IBM Tech Discl Bull, vol. 20, #9, p. 3742, Feb. 1978, Anacker, Liquid Cooling of IC Chips.
IEEE El. Circ. Conf. 1982, "Ultrahigh Thermal . . . Integrated Circuits", Tuckerman, pp. 145-149.
IEEE Electron Device Letters, vol. EDL-2, No. 5 1981, "High Perf Heat-Sink for VLSI", Tuckerman.
IBM Tech Discl Bull, vol. 23, #2, Jul. 1980, p. 579, Strudwick, "Silicon Tunnel Heat Sink".
Eastman Dean E.
Eldridge Jerome M.
Olive Graham
Petersen Kurt E.
IBM Corporation
Ohlandt John F.
Tolin G. P.
LandOfFree
Cooling system for VLSI circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling system for VLSI circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for VLSI circuit chips will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1482893