Cooling system for semiconductor modules

Details Cooling system for semiconductor modules Cooling system for semiconductor modules

1987-04-06

1988-09-06

Lazarus, Ira S.

Heat exchange

With retainer for removable article

Electrical component

361384, 165903, F28F 306

Patent

active

047685816

ABSTRACT:
A cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.

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