Cooling system for multiwafer high density circuit

Details Cooling system for multiwafer high density circuit Cooling system for multiwafer high density circuit

1979-03-26

1981-08-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361385, 361386, 357 82, H05K 720

Patent

active

042837545

ABSTRACT:
A high density arrangement for interconnecting integrated circuit devices, of a type which includes a stack of numerous wafers formed primarily of metal, wherein some of the wafers holding integrated circuit chips have overhanging edge portions at one side of the stack that extend beyond other wafers of the stack, and wherein there are cooling fluid tubes clamped against the overhanging edge portions to carry away heat to a cooling fluid flowing through the tube. The wafers are interconnected at numerous locations by button portions of malleable material such as gold, and the stack of wafers are clamped together to slightly deform the button portions to provide a considerable area of contact. The stack clamping device is separate from the cooling fluid tube clamping device, to provide different degrees of pressure and compressive strain.

REFERENCES:
patent: 3346773 (1967-10-01), Lomerson
patent: 3631325 (1971-12-01), Wenz
patent: 3648113 (1972-03-01), Rathjen
patent: 3917983 (1975-11-01), Kuronen
patent: 4019098 (1977-04-01), McCready
patent: 4107760 (1978-08-01), Zimmer

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