Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-06-28
2004-02-03
Tolin, G P (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C062S259200, C165S104330, C257S715000
Reexamination Certificate
active
06687125
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling system for an integrated circuit chip, and in particular to a cooling system for an integrated circuit chip which is capable of efficiently cooling heat generated at an integrated circuit chip.
2. Description of the Prior Art
Generally, a computer includes an input unit for inputting information, namely, data, a CPU (central processing unit) for processing data inputted through the input unit and an output unit for outputting data processed by the CPU, when a user inputs data through the input unit, the inputted data is processed by the CPU and is outputted through the output unit.
An input unit of a computer includes a keyboard, a mark reader, an optical character reader and an audio input unit, etc., and an output unit of a computer includes a monitor and a printer, etc.
Particularly, a main body of a computer consists of a main board mounted with plural integrated circuit chips such as a CPU, etc. and additional electronic parts; connection parts for transmitting/receiving signals with a hard disk as one of a storing unit, the main board and an input/output units; and a casing for receiving the main board, the hard disk and the connection parts, etc.
In addition, inside the casing of the main body, a power supply for supplying power is installed, and a cooling unit for radiating and cooling heat generated at the main board, the hard disk and the power supply, etc. placed inside the casing is installed.
FIG. 1
is a schematic perspective view illustrating a general computer, and
FIG. 2
is a sectional view illustrating a cooling unit for cooling a CPU of the computer shown in FIG.
1
.
In the meantime, in the operation of the computer, heat is generated at the main board, the hard disk and the power supply, etc., in order to operate the computer stably, heat generated in the main body of the computer has to be efficiently cooled.
As depicted in
FIG. 1
, in order to cool heat generated in the main body of the computer, a heat sink
40
is installed at a certain side of a main board
30
at which a CPU
20
is installed, and a fan assembly
50
for generating air flow is installed along with the heat sink
40
.
The heat sink
40
includes a contact surface
41
contacted to the CPU
20
of the main board
30
and plural radiation pins
42
perpendicularly extended from the contact surface
41
so as to have a certain thickness and area, and the fan assembly
50
includes a fan
52
and a fan motor
53
installed inside a fan housing
51
. The heat sink
40
is combined with the fan assembly
50
by the plural radiation pins
42
and plural bolts
60
.
When power is applied to the computer and the computer operates, high temperature heat is generated in the CPU
20
of the main board
30
, the heat generated in the CPU
20
is transmitted through the heat sink
40
.
Simultaneously, the fan assembly
50
installed at the heat sink
40
operates and generates air flow, by the air flow generated by the fan assembly
50
, outer air flows in through blast ports (not shown) formed at a certain side of the casing
10
, the heat transmitted to the heat sink
40
is radiated, and accordingly the CPU
20
of the main board
30
is cooled.
However, in the conventional computer cooling unit, there are limitations in cooling capacity and cooling speed, in addition, because the CPU
20
is cooled by the air flow, impurities may penetrate the casing
10
, it may cause failure of internal parts, in addition, noise may occur due to the operation of the fan assembly
50
.
In particular, with the development of information society, data processing speed of an integrated circuit chip such as a CPU, etc. has been rapidly improved, its data processing capacity has been remarkably increased/integrated, also capacity of additional construction parts has been improved, and accordingly an amount of heat generated in the operation of the computer has been greatly increased.
Because of those reasons, in a general cooling system using a fan assembly to cool an integrated circuit chip, it is impossible to cool sufficiently lots of heat generated in the integrated circuit chip, and accordingly wrong operation or a failure of the integrated circuit chip may occur due to over heat.
SUMMARY OF THE INVENTION
In order to solve the above-mentioned problems, it is an object of the present invention to provide a cooling system for an integrated circuit chip which is capable of efficiently cooling lots of heat generated in an integrated circuit chip.
In order to achieve the above-mentioned object, it is an object of the present invention to provide a cooling system for an integrated circuit chip including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means.
In addition, it is another object of the present invention to provide a cooling system for an integrated circuit chip including an evaporator contacted-combined with an integrated circuit chip installed onto a board fixed to a frame and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed at the frame by a board combining means and mounted with the compressor, the condenser and the expansion means.
REFERENCES:
patent: 4729424 (1988-03-01), Mizuno et al.
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 6205796 (2001-03-01), Chu et al.
USPGPUB 2002/0023453 A1, filed Feb. 28, 2002, Davidson et al.*
USPGPUB 2003/0019235 A1, filed Jan. 30, 2003, Wall et al.
Hong Eon-Pyo
Jung Jin-Young
Lee Hyeong-Kook
Park Jung-Sik
Park Yong-Dol
Fleshner & Kim LLP
LG Electronics Inc.
Tolin G P
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