Cooling system for enclosed electronic components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361687, H05K 720

Patent

active

057936080

ABSTRACT:
An enclosure contains, among other components, hard drive cartridges, graphics or other option cards, power supply and a CPU and its support chips. The total power in the whole enclosure is about 325W and the CPU consumes about 30W of this total. For design purposes the components are closely positioned and hence heat dissipation is an important problem. Plural fans, as hereinafter disclosed, are used to circulate air. For the hard drive cartridges a fan snapped into a sidewall of the enclosure draws air from apertures in the bottom through the cartridge and into a plenum. For the CPU, an impingement fan discharges air directly downward on a heat sink positioned over the chip and into the plenum. Bulk flow fans discharge air from air intake vents in side walls of the enclosure as well as air discharged from the hard drive and CPU through an internal wall into a separate sub-enclosure for the power supply and thence to the exterior. Conventional fans are used but are positioned and inter-related so that the noise level is tolerable.

REFERENCES:
patent: 4277816 (1981-07-01), Dunn et al.
patent: 4702154 (1987-10-01), Dodson
patent: 4751872 (1988-06-01), Lawson, Jr.
patent: 4911231 (1990-03-01), Horne et al.
patent: 5132780 (1992-07-01), Higgins, III
patent: 5361188 (1994-11-01), Kondou et al.
patent: 5402312 (1995-03-01), Kinjo et al.
patent: 5484012 (1996-01-01), Hiratsuka
patent: 5522700 (1996-06-01), Hong
patent: 5576932 (1996-11-01), Bishop et al.

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