Cooling system for electronics with improved thermal interface

Details Cooling system for electronics with improved thermal interface Cooling system for electronics with improved thermal interface

2005-04-26

2005-04-26

Bennett, Henry (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300, C165S104260, C165S185000, C361S689000, C361S699000, C361S700000, C257S714000, C257S715000, C257S716000, C174S015200

Reexamination Certificate

active

06883594

ABSTRACT:
A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

REFERENCES:
patent: 4204246 (1980-05-01), Arii et al.
patent: 4912548 (1990-03-01), Shanker et al.
patent: 5029389 (1991-07-01), Tanzer
patent: 5095404 (1992-03-01), Chao
patent: 5339214 (1994-08-01), Nelson
patent: 5549155 (1996-08-01), Meyer et al.
patent: 5826645 (1998-10-01), Meyer et al.
patent: 5884693 (1999-03-01), Austin et al.
patent: 5890371 (1999-04-01), Rajasubramanian et al.
patent: 5946187 (1999-08-01), Cipolla
patent: 5966286 (1999-10-01), O'Connor et al.
patent: 5992155 (1999-11-01), Kobayashi et al.
patent: 6006827 (1999-12-01), Lu
patent: 6031716 (2000-02-01), Cipolla et al.
patent: 6069791 (2000-05-01), Goto et al.
patent: 6076595 (2000-06-01), Austin et al.
patent: 6084178 (2000-07-01), Cromwell
patent: 6094344 (2000-07-01), Nakagawa et al.
patent: 6122166 (2000-09-01), Mochizuki et al.
patent: 6122167 (2000-09-01), Smith et al.
patent: 6125035 (2000-09-01), Hood et al.
patent: 6141215 (2000-10-01), Podwalny et al.
patent: 6148906 (2000-11-01), Li et al.
patent: 6152213 (2000-11-01), Suzuki
patent: 6301107 (2001-10-01), Lev et al.
patent: 6328097 (2001-12-01), Bookhardt et al.
patent: 6347036 (2002-02-01), Yeager et al.
patent: 6352103 (2002-03-01), Chu et al.
patent: 6359780 (2002-03-01), McMahan et al.
patent: 6373700 (2002-04-01), Wang
patent: 6400565 (2002-06-01), Shabbir et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6650540 (2003-11-01), Ishikawa
patent: 6695041 (2004-02-01), Lai et al.
patent: 6708754 (2004-03-01), Wei
patent: 6732786 (2004-05-01), Lee
patent: 6752201 (2004-06-01), Cipolla et al.
patent: D494549 (2004-08-01), Lee
patent: 6830098 (2004-12-01), Todd et al.
patent: 20030019607 (2003-01-01), Wei

Affiliated with

Also associated with

Rating

Cooling system for electronics with improved thermal interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling system for electronics with improved thermal interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for electronics with improved thermal interface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3395923