Cooling system for electronic structural units

Details Cooling system for electronic structural units Cooling system for electronic structural units

2011-05-10

2011-05-10

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S698000, C361S701000, C165S080400, C165S080500, C165S147000, C257S714000, C174S015100

Reexamination Certificate

active

07940527

ABSTRACT:
Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler wall (7). A coolant guide apparatus (11) is provided in the cooling channel (6) and has insert conduit elements (13) for guiding the coolant onto the cooler wall indentations (12). The end of each insert conduit (13) opening to the cooling channel (6) may be provided with an inclined entry surface (19) and an inlet opening (20) towards the inner longitudinal channel (14). A plurality of such coolant guides (11) may be arranged in series so that, for example, the same cooling medium flows through a plurality of semiconductor modules in succession.

REFERENCES:
patent: 3455376 (1969-07-01), Beurtheret
patent: 4103737 (1978-08-01), Perkins
patent: 4699208 (1987-10-01), Wolf et al.
patent: 4909315 (1990-03-01), Nelson et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 5002123 (1991-03-01), Nelson et al.
patent: 5072787 (1991-12-01), Nakamichi
patent: 5228502 (1993-07-01), Chu et al.
patent: 5239443 (1993-08-01), Fahey et al.
patent: 6386278 (2002-05-01), Schulz-Harder
patent: 6431260 (2002-08-01), Agonafer et al.
patent: 7044212 (2006-05-01), Hofmann
patent: 7208872 (2007-04-01), Miyadera
patent: 7277284 (2007-10-01), Lee et al.
patent: 2009/0101313 (2009-04-01), Hofmann
patent: 1614521 (1970-02-01), None
patent: S62-216349 (1987-09-01), None
Search Report and Intn'l. Preliminary Report on Patentability, parent application PCT/IB2009/052559 filed Jun. 16, 2009.
“Multi-Chip Package With Cooling by a Spreader Plate in Contact With a Chip Having Cylindrical Holes Mating With an Inverse Frame Providing Water Flow Within its Pins,” from vol. 31, No. 5, Oct. 1, 1998 IBM Technical Disclosure Bulletin, pp. 141-142, publisher IBM Corp., New York, NY.
Andrews, J.A. “Parallel Printed Circuit Manifold,” from vol. 7, Oct. 1, 1987 Motorola Technical Developments, pp. 22-23, publisher Motorola Inc., Schaumburg, Illinois.

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