Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-08-02
2002-11-26
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C312S236000, C454S184000
Reexamination Certificate
active
06487074
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a cooling system for electronic devices such as a note-type personal computer, a desk top-type computer or the like.
RELATED ART
In general, various cooling systems have been introduced to cool heat generated from heat generating components such as a CUP or the like in electronic devices.
FIG. 5
is a schematic cross-sectional view of a conventional cooling system for electronic devices. As shown in
FIG. 5
, the conventional cooling system for electronic devices includes a heat pipe
52
thermally connected to a heat generating component
51
such as a CPU or the like installed within a case
50
, and a heat sink having pin-type fin
53
which is thermally connected to the heat pipe
52
. A fan
56
is attached to the heat sink
54
in the vicinity of outlet port
55
of the case
50
.
According to the conventional cooling system for electronic devices, the heat generated from the heat generating component
51
is transferred through the heat pipe
52
to the heat sink
54
, and then, exhaled through the outlet port
55
by means of the rotation of the fan
56
.
SUMMARY OF THE INVENTION
The present invention relates to a cooling system for an electronic device in which a highly cooling effect can be obtained even if the space within the case is small. One embodiment of a cooling system for an electronic device of the present invention comprises a cooling system for an electronic device including a heat generating component within a case, wherein said heat generating component is installed on a bottom plate of said case, said bottom plate is made of a heat transfer material with a ventilating hole for air passage formed therein, and a foot portion installed outer surface of said case for maintaining a prescribed vertically opened space below the lower surface of the case.
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patent: 5414591 (1995-05-01), Kimura et al.
patent: 5813243 (1998-09-01), Johnson et al.
patent: 5875965 (1999-03-01), Lee
patent: 5934368 (1999-08-01), Tanaka et al.
patent: 6011689 (2000-01-01), Wrycraft
patent: 6094347 (2000-07-01), Bhatia
patent: 6141214 (2000-10-01), Ahn
patent: 6278607 (2001-08-01), Moore et al.
patent: 2000-277957 (2000-10-01), None
Kimura Naoki
Maekawa Hiroaki
Niekawa Jun
Knobbe Martens Olson & Bear LLP
The Furukawa Electric Co. Ltd.
Tolin Gerald
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