Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-09-19
2001-11-13
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S694000, C174S016100, C174S015100, C312S223100, C454S184000
Reexamination Certificate
active
06317320
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling system and more particularly to a direct flow impingement cooling system for electronic components mounted in panels in an equipment enclosure or cabinet.
2. Description of the Related Art
Various types of equipment for telephone, cable television, wireless applications and the like are placed out-of-doors in equipment enclosures which generally are free standing cabinets that are mounted to a concrete pad. As electronic components for this equipment have become more sophisticated and powerful, they have also generated more heat. Thus, thermal management for equipment cabinets have become increasingly important. Further, heat dissipation requirements vary greatly from one type of component to another.
Generally, the cabinets include an upper sealed chamber for most components, a lower battery chamber and end chambers. Heat management within the sealed chamber is handled by a heat exchanger or an air conditioning unit. However, in the end chambers there typically is no heat management device other than vents to the ambient air. Hence, components that are placed in the end chambers are generally heat insensitive. Nevertheless, supplemental cooling systems have been developed and used in end chambers when and where they are needed. For example, fan units such as the Marconi AIRACK brand fan assembly have been used for auxiliary cooling. The AIRACK fan assembly can be located anywhere within the end chamber racks containing electronic components so as to be adjacent to those components that have specific cooling needs.
Other mechanisms for cooling heat generating electronic components include small fans directly attached to heat sinks which are in turn attached to the heat generating electronic component such as a Pentium brand processor. Also, journal articles have been published dealing with equipment to achieve high convective heat transfer rates. For example, an article entitled “Experimental Optimization Of Confined Air Jet Impingement On A Pin Fin Heat Sink” was published in IEEE Transactions On Components And Packaging Technology, Volume 22, No. 3, at page 399 dated September 1999. Another article entitled “A Heat Sink Performance Study Considering Material, Geometry, Nozzle Placement, And Reynolds Number With Air Impingement” appeared in Transactions Of The ASME, Volume 121, at page 156, dated September 1999.
As more powerful electronic components are developed and put into use, a continuing need has developed for systems to cool these devices to ensure that they function properly and at more optimum levels.
BRIEF SUMMARY OF THE INVENTION
The present invention provides an improved cooling system for electronic components such as those used in uncooled end chambers of freestanding equipment cabinets, the system comprising a component panel formed of a main housing adapted to be mounted to a rack in the cabinet, the housing for containing heat generating electronic components, a cover housing having a front wall with openings for air flow, left and right side walls having exhaust openings, a plurality of fans mounted within the cover housing and located behind the front wall with each of the fans positioned behind one of the air flow openings, a back plate also mounted within the cover housing and located behind or downstream of the fans, and a hinge connecting the cover housing and the main housing for allowing the cover housing to move between opened and closed positions. The system effectively cools the components and also allows easy access for maintenance of the components within the panel.
An object of the present invention is to provide direct cooling of over-current protector modules mounted within an equipment cabinet. Another aspect of the present invention is to provide a cooling system for high heat removal from a densely packed equipment cabinet. Yet another advantage of the present invention is to provide a cooling system with sufficient heat removal capacity to allow the temperature of a handle of an over-current protector to be low enough to be safely touched by maintenance personnel. Still another aim of the present invention is to provide a cooling system to lower the temperature of densely packed over-current protectors to about 4° C. above ambient with less than a 2° C. difference across a filled panel. It is yet another object of the present invention to provide a cooling system to lower the internal temperature of an over-current protector module by as much as 45° C.
A more complete understanding of the present invention and other objects, aspects, aims and advantages thereof will be gained from a consideration of the following description of the preferred embodiment read in conjunction with the accompanying drawing provided herein.
REFERENCES:
patent: 4262317 (1981-04-01), Baumbach
patent: 4751872 (1988-06-01), Lawson, Jr.
patent: 4901188 (1990-02-01), Gilberts
patent: 5001602 (1991-03-01), Suffi et al.
patent: 5136463 (1992-08-01), Webster
patent: 5523916 (1996-06-01), Kaczmarek
patent: 5562410 (1996-10-01), Sachs et al.
patent: 5570740 (1996-11-01), Flores et al.
patent: 5832988 (1998-11-01), Mistry et al.
patent: 6040981 (2000-03-01), Schmitt et al.
patent: 6071082 (2000-06-01), Lecinski et al.
patent: 6075698 (2000-06-01), Hogan et al.
patent: 003408139-A1 (1985-09-01), None
Brigoni & Garimella, “experimental Optimization of Confined Air Jet Impingement on a Pin Fin Heat Sink”, IEEE Transactions On Components and Packaging Technology, vol. 22, No. 3, Sep. 3, 1999, pp. 399-404.
Maveety & Hendricks, “A Heat Sink Performance Study Considering Material, Geometry, Nozzle Placement, and Reynolds Number with Air Impingement”, ASME, vol. 121, Sep. 1999, pp. 156-161.
Cosley Michael R.
Garcia Marvin P.
Mueller Don C.
Chervinsky Boris L.
Jones Day Reavis & Pogue
Marconi Communications Inc.
Picard Leo P.
LandOfFree
Cooling system for electronic components in an equipment... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling system for electronic components in an equipment..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for electronic components in an equipment... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2617448