Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1985-01-25
1988-03-01
Pellinen, A. D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
165 804, 357 82, 361382, H05K 720
Patent
active
047290609
ABSTRACT:
A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
REFERENCES:
patent: 3649738 (1972-03-01), Andersson et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4155402 (1979-05-01), Just
patent: 4156458 (1979-05-01), Chu et al.
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4381032 (1983-04-01), Cutchaw
patent: 4561011 (1985-12-01), Kohara et al.
Miller, "Structure for Achieving Thermal Enhancement in a Semiconductor Package", IBM Tech. Disc. Bul., vol. 23, No. 6, 11/80, p. 2308.
Gupta et al., "Protection Device for Fluid-cooled Electrical Apparatus", IBM Tech. Disc. Bul., vol. 24, No. 2, 7/81, pp. 955-956.
Andros et al., "Heat Transfer Apparatus", IBM Tech. Disc. Bul., vol. 22, No. 8A, 1/80, p. 3166.
Brunsch et al. "Semiconductor Chip Cooling System with Temperature Regulation", IBM Tech. Dis. Bul., vol. 24, No. 9, 2/82, pp. 4796-4797.
Shapiro, "IBM Technical Disclosure Bulletin", vol. 25, No. 1, Jun., 1982, p. 44.
Doo et al., "IBM Technical Disclosure Bulletin", vol. 20, No. 4, Sep., 1977, pp. 1436-1437.
Clark et al., "IBM Technical Disclosure Bulletin", vol. 20, No. 5, Oct., 1977, pp. 1769-1771.
Katsuyama Kouji
Nakata Mitsuhiko
Sakai Masaaki
Udagawa Yoshiaki
Yamamoto Haruhiko
Fujitsu Limited
Pellinen A. D.
Thompson Gregory D.
LandOfFree
Cooling system for electronic circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling system for electronic circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for electronic circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1002602