Cooling system for dual-in-line packages

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361385, 361386, 339 17F, H05K 720

Patent

active

041158369

ABSTRACT:
A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type including a carrier heat sink plate which form web sections which engage the bodies of the DIP held side-by-side thereon. The plate is thermally and mechanically connected by means of a clamping device to a cooling frame in which a serpentine tubing carries coolant throughout spaced apart sections thereof, so that the heat generated by the DIP's is carried away by the heat sink plate into the frame sections where the coolant circulate. The DIP pins are electrically connected to a printed circuit board and to relatively flat flexible ribbon type printed circuit type cable the latter being clamped at each end into a standard connector which itself is clamped to an island printed circuit board having conductors thereon for connecting the DIP's to other electronic devices. Multiplicity of these DIP's so mounted in the cooling frame may be housed in the same console or housing along with other DIP islands as desired.

REFERENCES:
patent: 3719860 (1973-03-01), Lawrence
patent: 3727168 (1973-04-01), Henschen
patent: 3946276 (1976-03-01), Braun
patent: 3999826 (1976-12-01), Yurtin
patent: 4026011 (1977-05-01), Walton

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