Cooling system for densely packed electronic components

Details Cooling system for densely packed electronic components Cooling system for densely packed electronic components

2007-08-21

2007-08-21

Duong, Tho (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080400

Reexamination Certificate

active

10759708

ABSTRACT:
A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.

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