Cooling system for densely packed electronic components

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

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C165S080400

Type

Reexamination Certificate

Status

active

Patent number

10759708

Description

ABSTRACT:
A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 3481393 (1969-12-01), Chu
patent: 3917370 (1975-11-01), Thornton et al.
patent: 4151548 (1979-04-01), Klein et al.
patent: 4315300 (1982-02-01), Parmerlee et al.
patent: 4392362 (1983-07-01), Little
patent: 4493010 (1985-01-01), Morrison et al.
patent: 4498118 (1985-02-01), Bell
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4612978 (1986-09-01), Cutchaw
patent: 4685512 (1987-08-01), Edelstein et al.
patent: 4866570 (1989-09-01), Porter
patent: 4940085 (1990-07-01), Nelson et al.
patent: 4941530 (1990-07-01), Crowe
patent: 4958257 (1990-09-01), Wenke
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5057968 (1991-10-01), Morrison
patent: 5067047 (1991-11-01), Azar
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5099910 (1992-03-01), Walpole et al.
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5169372 (1992-12-01), Tecco
patent: 5177666 (1993-01-01), Bland et al.
patent: 5179500 (1993-01-01), Koubek et al.
patent: 5183104 (1993-02-01), Novotay
patent: 5216578 (1993-06-01), Zenitani et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5220809 (1993-06-01), Voss
patent: 5285347 (1994-02-01), Fox et al.
patent: 5316075 (1994-05-01), Quon et al.
patent: 5365749 (1994-11-01), Porter
patent: 5394936 (1995-03-01), Budelman
patent: 5509468 (1996-04-01), Lopez
patent: 5544696 (1996-08-01), Leland
patent: 5587880 (1996-12-01), Phillips et al.
patent: 5696405 (1997-12-01), Weld
patent: 5769154 (1998-06-01), Adkins et al.
patent: 5823005 (1998-10-01), Alexander et al.
patent: 5870823 (1999-02-01), Bezama et al.
patent: 5923533 (1999-07-01), Olson
patent: 6039114 (2000-03-01), Becker et al.
patent: 6679315 (2004-01-01), Cosley et al.
patent: 2003/0010050 (2003-01-01), Scott
Little, William, Mar. 1978, IBM Corp., vol. 20 No. 10, p. 3919.
“An Electrodynamic Polarization Micropump for Electronic Cooling”; J. Darabi and D. DeVoe; Journal of Microelectromechanical Systems, vol. 10, No. 1, pp. 98-106, Mar. 2001.
“Heat Transfer from Micro-Finned and Flat Surfaces to Flow of Fluorinert Coolant; Boiling Heat Transfer”; Mizunuma et al.; 1998 InterSociety Conference on Thermal Phenomena, pp. 386-391, Aug. 1998.
“Imersion Cooling of Electronics in Fluidized Beds of Dielectric Particles”; Robert C. Brown and Scott S. Jasper; Heat Transfer Engineering, vol. 10, No. 3 pp. 36-42, 1989.
“Optimal Structure for Microgrooved Cooling Fin to High-Power LSI Devices”; S. Sasaki and T. Kishimoto; Electronics & Mechanics Technology Laboratories, Oct. 21, 1986.
“Gas Cooling Enhancement Technology for Integrated Circuit Chips”; Kishimoto et al.; IEEE Transactions of Components, Hybrids, and Manufacturing Technology, vol. CHMT-7, No. 3, pp. 286-293, Sep. 1984.
“The Effect of Tip Convection on the Performance and Optimum Dimensions of Cooling Fins”; K. Laor and H. Kalman; Int. Comm. Heat mass. Transfer, vol. 19, pp. 569-584, 1992.
“Pool Boiling Heat Transfer From Plain and Microporous, Square Pin-Finned Surfaces in Saturated FC-72”; K.N. Rainey and S.M. You; Journal of Heat Transfer, vol. 122, pp. 509-516, Aug. 2000.
“Effects of Perpendicular Flow Entry on Convective Heat/Mass Transfer From Pin-Fin Arrays”; Chyu et al.; Journal of Heat Transfer; vol. 121, pp. 668-674, Aug. 1999.
“Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface”; S.M. You et al; Journal of Electronic Packaging; vol. 119, pp. 17-24, Mar. 1997.
“Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package”; A.A. Watwe et al; Journal of Electronic Packaging, vol. 199, pp. 95-105, Jun. 1997.
“Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology”; Perret et al.; IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 4, pp. 665-671, Dec. 2000.

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