Cooling system for cooling an electronic device and heat radiati

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

361381, 361389, 165 803, 174 151, 357 82, H01L 2302, H01L 2504, H02B 100, H05K 720

Patent

active

050776010

ABSTRACT:
A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

REFERENCES:
patent: 4335781 (1982-06-01), Duffy
patent: 4730233 (1988-03-01), Osterman
patent: 4765397 (1988-08-01), Chrysler
patent: 4859520 (1989-08-01), Dubuisson et al.
Staver Co. Advertisement, `Thermo-Vanes`, Electronic Design, Jul. 5, 62, p. 16.

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