Heat exchange – Movable heating or cooling surface
Patent
1993-04-06
1994-07-26
Davis, Jr., Albert W.
Heat exchange
Movable heating or cooling surface
16510414, 16510433, 62 37, 622592, H01L 23427
Patent
active
053320310
ABSTRACT:
A cooling system for cooling heat-producing electronic devices, such as CCDs, included in an electronic apparatus, such as a television camera, comprises electronic cooling devices disposed near the heat-producing electronic devices, buffering heat conducting mechanisms connecting the heat-producing electronic devices to the electronic cooling devices to transfer heat by conduction from the heat-producing electronic devices to the electronic cooling devices, a motor-driven fan disposed in an air passage formed by dividing the interior of the body of the electronic apparatus by a partition wall, and a heat radiating coil unit is formed by coiling a small tube in loops and sealing a heat conveying fluid in the small tube, such coil unit having heat absorbing portions connected to the electronic cooling devices and a heat radiating portion disposed in the air passage. Heat produced by the heat-producing electronic devices is transferred by conduction from the heat-producing devices to the electronic cooling devices through the buffering heat conducting mechanisms, an then conveyed by the heat conveying fluid to the heat radiating portion of the heat radiating coil unit from where heat is radiated into air flowing through the air passage.
REFERENCES:
patent: 4314449 (1982-02-01), Reisman et al.
patent: 4921041 (1990-05-01), Abachi
patent: 5040381 (1991-08-01), Hazen
Davis Jr. Albert W.
Frommer William S.
Sinderbrand Alvin
Sony Corporation
LandOfFree
Cooling system for cooling a solid-state imaging device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling system for cooling a solid-state imaging device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for cooling a solid-state imaging device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1048228