Cooling system for an electronic circuit device

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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357 82, 361385, H05K 720

Patent

active

047837217

ABSTRACT:
A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

REFERENCES:
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4688147 (1987-08-01), Ono
Follete, "All Purpose Chip Carrier", IBM Tech. Discl. Bull., vol. 20, No. 10, 3/78, pp. 4028, 4029.
Hwang, "Conduction Cooling Module", IBM Tech. Discl. Bull., vol. 20, No. 11A, 4/78, pp. 4334.
"Visualization of Flow", by Ji Young Cha et al. published in Japan on Jul. 1983, pp. 269-274.

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