Heat exchange – With retainer for removable article – Electrical component
Patent
1987-04-09
1989-01-03
Lazarus, Ira S.
Heat exchange
With retainer for removable article
Electrical component
165185, 361387, 29829, 29840, F28F 700, H05K 720
Patent
active
047949813
ABSTRACT:
A cooling system for electronic components includes a substrate on which electronic components are mounted. A first layer made of adhesive material is provided on a surface of the substrate opposite the components and a second layer made of a material having a relatively low melting point is provided on the first layer. Heat radiating means are provided on the second layer to outwardly radiate heat transmitted from the electronic components through the substrate, first layer and second layer.
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IBM Bulletin "High Performance Air-Cooled Module", vol. 28, No. 7, Dec. 1985.
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, "Method of Effective Cooling of a High Power Silicon Chip", Dee et al.
Lazarus Ira S.
NEC Corporation
Neils Peggy
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