Cooling structure of power semiconductor device and inverter

Details Cooling structure of power semiconductor device and inverter Cooling structure of power semiconductor device and inverter

2011-01-25

2011-01-25

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S015100, C257S714000, C257S715000, C165S080400, C165S080500, C165S104330, C363S141000

Reexamination Certificate

active

07876563

ABSTRACT:
A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins have ends facing the upstream side of a cooling water flow. The end of at least one fin among the plurality of fins is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends of the fins adjacent to both sides of the at least one fin. By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency.

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