Cooling structure, heatsink and cooling method of heat...

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S185000, C361S699000

Reexamination Certificate

active

08061412

ABSTRACT:
A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility; and a fluid flow path that is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid, a fine recess is disposed.

REFERENCES:
patent: 3921201 (1975-11-01), Eisele et al.
patent: 3984861 (1976-10-01), Kessler, Jr.
patent: 4027728 (1977-06-01), Kobayashi et al.
patent: 4572286 (1986-02-01), Fujii et al.
patent: 4694323 (1987-09-01), Itahana et al.
patent: 4704658 (1987-11-01), Yokouchi et al.
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5050037 (1991-09-01), Yamamoto et al.
patent: 5150274 (1992-09-01), Okada et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5212625 (1993-05-01), Van Andel et al.
patent: 5315480 (1994-05-01), Samarov et al.
patent: 5316077 (1994-05-01), Reichard
patent: 5365402 (1994-11-01), Hatada et al.
patent: 5959351 (1999-09-01), Sasaki et al.
patent: 5978220 (1999-11-01), Frey et al.
patent: 6000603 (1999-12-01), Koskenmaki et al.
patent: 6055154 (2000-04-01), Azar
patent: 6059024 (2000-05-01), Ramshaw et al.
patent: 6084771 (2000-07-01), Ranchy et al.
patent: 6257320 (2001-07-01), Wargo
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6367541 (2002-04-01), McCullough
patent: 6496367 (2002-12-01), Donahoe et al.
patent: 6867973 (2005-03-01), Chang
patent: 6919504 (2005-07-01), McCutcheon et al.
patent: 6992887 (2006-01-01), Jairazbhoy et al.
patent: 7007741 (2006-03-01), Sen et al.
patent: 7077858 (2006-07-01), Fletcher et al.
patent: 7190580 (2007-03-01), Bezama et al.
patent: 7254030 (2007-08-01), Chiba et al.
patent: 7399919 (2008-07-01), McCutcheon et al.
patent: 7593228 (2009-09-01), Jarrett et al.
patent: 2005/0072559 (2005-04-01), Ippoushi et al.
patent: 2005/0083655 (2005-04-01), Jairazbhoy et al.
patent: 5-63385 (1993-03-01), None
patent: 7-507658 (1995-08-01), None
patent: 9-121557 (1997-05-01), None
patent: 11-504767 (1999-04-01), None
patent: 2003-324173 (2003-11-01), None
patent: 2005-166578 (2005-06-01), None
patent: 2005-244014 (2005-09-01), None
patent: WO 93/24955 (1993-12-01), None
patent: WO 97/31512 (1997-08-01), None
patent: WO 99/66282 (1999-12-01), None

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