Cooling structure for power supply device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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H05K 720

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active

054249155

ABSTRACT:
A power supply device includes power semiconductor devices generating Joule's heat by themselves and circuit components generating no considerable heat by themselves but, as a group, generate a slight rise in temperature, which are included in a power supply circuit of the device. A structure is arranged to forcibly cool these semiconductor devices and circuit components by partitioning the interior of a housing of the Dower supply device to form a passage for an air flow, providing the housing with inlet and outlet openings for the air flow and providing the passage with a ventilating fan.

REFERENCES:
patent: 4035711 (1977-07-01), Piller
patent: 4236055 (1980-11-01), Kaminaka
patent: 4956531 (1990-09-01), Braunijch et al.

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