Cooling structure for multichip module

Details Cooling structure for multichip module Cooling structure for multichip module

2005-11-29

2005-11-29

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S685000, C257S706000, C257S712000, C257S717000, C257S720000, C257S723000, C257S796000, C257S930000, C257SE23080, C257SE23081, C257SE23082, C257SE23101, C257SE23102, C257SE23083

Reexamination Certificate

active

06969907

ABSTRACT:
A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.

REFERENCES:
patent: 4558395 (1985-12-01), Yamada et al.
patent: 5021924 (1991-06-01), Kieda et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5323292 (1994-06-01), Brzezinski
patent: 5345107 (1994-09-01), Daikoku et al.
patent: 5480840 (1996-01-01), Barnes et al.
patent: 5500555 (1996-03-01), Ley
patent: 5751062 (1998-05-01), Daikoku et al.
patent: 5844311 (1998-12-01), Watanabe et al.
patent: 5859763 (1999-01-01), Nam et al.
patent: 5930135 (1999-07-01), Janko
patent: 5959352 (1999-09-01), Topfer et al.
patent: 6046410 (2000-04-01), Wojnarowski et al.
patent: 6046498 (2000-04-01), Yoshikawa
patent: 6138348 (2000-10-01), Kulesza et al.
patent: 6144013 (2000-11-01), Chu et al.
patent: 6366461 (2002-04-01), Pautsch et al.
patent: 6393169 (2002-05-01), Paniccia et al.
patent: 6469895 (2002-10-01), Smith et al.
patent: 6642064 (2003-11-01), Terrill et al.
patent: 2001/0001989 (2001-05-01), Smith
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2002/0003232 (2002-01-01), Ahn et al.
patent: 0 361 495 (1990-04-01), None
patent: 0 376 478 (1990-07-01), None
patent: 2 2665 046 (1992-01-01), None
patent: 08-195455 (1996-07-01), None
patent: 11 121666 (1999-04-01), None
patent: 11-121666 (1999-04-01), None
patent: WO 98 12748 (1998-03-01), None

Affiliated with

Also associated with

Rating

Cooling structure for multichip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling structure for multichip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling structure for multichip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3495144