Cooling structure for multi-chip module

Details Cooling structure for multi-chip module Cooling structure for multi-chip module

1998-02-03

2000-02-08

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, H05K 720

Patent

active

06023413&

ABSTRACT:
A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink, a cooling fan, and openings. In the multi-chip module, a plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.

REFERENCES:
patent: 5063476 (1991-11-01), Hamada
patent: 5353863 (1994-10-01), Yu
patent: 5689404 (1997-11-01), Katsui
patent: 5785116 (1998-07-01), Wagner
patent: 5794685 (1998-08-01), Dean
patent: 5864464 (1999-01-01), Lin
patent: 5932925 (1999-08-01), McIntyre
patent: 5953208 (1999-09-01), Katsui
Nikkei Byte, No. 155, pp. 150-151, Sep. 1996 w/English description.

Affiliated with

Also associated with

Rating

Cooling structure for multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling structure for multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling structure for multi-chip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1685880