Cooling structure for integrated circuits

Details Cooling structure for integrated circuits Cooling structure for integrated circuits

1987-12-21

1988-09-06

Capossela, Ronald C.

Refrigeration

Movable thermal means varying heat transmission

165 804, 357 82, 361385, F25D 312

Patent

active

047683520

ABSTRACT:
A cooling structure for cooling integrated circuits. The cooling structure includes integrated circuit cases inside which one of more integrated circuits are mounted. Cold plates are also included which are superimposed on heat radiation surfaces of the integrated circuit cases, respectively, the cold plates each having one end of which is bent. Pressing members are also included which are superimposed on the cold plates, respectively, the pressing members each having one end of which is bent to oppose the bent one end of a respective one of the cold plates. The cooling structure also includes fixing means which fixes each of the cold plates and a corresponding one of the pressing members to corresponding one or more of the integrated circuit cases in a freely detachable manner. The cooling structure also includes cooling pipes with each of the cooling pipes being held in at least one space formed between one end of at least one of the cold plates and one end of a corresponding one of the pressing members.

REFERENCES:
patent: 2783418 (1957-02-01), Peter et al.
patent: 3211969 (1965-10-01), Colaiaco
patent: 3908188 (1975-09-01), Kawamoto
patent: 3912001 (1975-10-01), Missman et al.
patent: 4093971 (1978-06-01), Chu et al.
patent: 4110549 (1978-08-01), Goetzke et al.
patent: 4196775 (1980-04-01), Groh
Bhattacharya et al: "Chip Cooling Package", IBM Technical Disclosure Bulletin, vol. 21, No. 2, 7/1978.

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