Cooling structure for integrated circuits

Details Cooling structure for integrated circuits Cooling structure for integrated circuits

1992-06-01

1994-02-08

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 257714, H05K 720

Patent

active

052853519

ABSTRACT:
A cooling structure cools integrated circuits (I.C.'s) by circulating a liquid coolant in the vicinity of the I.C.'s and causing the heat generated by the I.C.'s to be conducted to the liquid coolant. The cooling structure includes a wiring substrate, an I.C. mounted on the wiring substrate, storage means for a liquid coolant having an opening in its bottom and an inlet and an outlet for the liquid coolant at its top, adhering means for fastening together the bottom of the storage means and the heat radiating face of the I.C., and spraying means for directly spraying the liquid coolant on the heat radiating face of the I.C. through the opening.

REFERENCES:
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4791983 (1988-12-01), Nicol
patent: 4977444 (1990-12-01), Nakajima
patent: 5021924 (1991-06-01), Kieda
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5097385 (1992-03-01), Chu
patent: 5168348 (1992-12-01), Chu
Oktay et al., "A conduction-cooled module for high-performance LSI devices", IBM J. Res. Develop., Jan. 1982, vol. 26, No. 1, pp. 55-66.

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