Cooling structure for electronics devices

Details Cooling structure for electronics devices Cooling structure for electronics devices

1991-11-19

1993-09-07

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257718, 257723, 257730, H01L 2302, H01L 2316

Patent

active

052432181

ABSTRACT:
A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat generation; at least one auxiliary printed circuit board has mounted thereon a second electronic device with high heat generation, which is connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).

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