Cooling semiconductor device and manufacturing method thereof

Details Cooling semiconductor device and manufacturing method thereof Cooling semiconductor device and manufacturing method thereof

2006-11-21

2009-08-04

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE31131, C361S701000

Reexamination Certificate

active

07569931

ABSTRACT:
A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a channel formed in the first diffusion region to receive a cooling fluid.

REFERENCES:
patent: 5395802 (1995-03-01), Kiyota et al.
patent: 5998240 (1999-12-01), Hamilton et al.
patent: 6768182 (2004-07-01), Oyamatsu et al.
patent: 2003/0102510 (2003-06-01), Lim et al.

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