Cooling powdering method with low temperature gas flow circulati

Refrigeration – Processes – Reducing pressure on compressed gas

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

62402, F25B 900

Patent

active

057299862

ABSTRACT:
A cooling powdering method with low temperature gas flow circulation including a gas expansion cooling circulation system, a low temperature gas flow powdering system and a material refrigerating system. The gas expansion cooling circulation system serves to provide cold capacity for the low temperature gas flow powdering system and material refrigerating system and the gas flow powdering machine serves to powder the material. The method is able to powder those materials which are impossible or difficult to be powdered at normal temperature, especially for resilient polymer materials and high resilient bodies.

REFERENCES:
patent: 5317904 (1994-06-01), Bronicki

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cooling powdering method with low temperature gas flow circulati does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling powdering method with low temperature gas flow circulati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling powdering method with low temperature gas flow circulati will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2281039

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.