Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-09-13
2005-09-13
Wille, Douglas (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C361S689000
Reexamination Certificate
active
06943444
ABSTRACT:
A structure (microduct) for temperature management (e.g., cooling) of the surface temperature of an electronic device (e.g., a microprocessor). In an embodiment of the present invention, the system includes an upper plate , wherein the upper plate has a bottom surface forming the top portion and sides of the microduct structure, and wherein the top surface of a lower wall forms the bottom surface of the microduct structure. The lower wall can be adapted to be coupled to a top surface of device. The microduct structure further includes a coolant that flows through the microduct to provide cooling for a device.
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Hamann Hendrik
Prikas Michael T.
von Gutfeld Robert J.
Cheung Wan Yee
Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
Gibbons Jon A.
Wille Douglas
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