Cooling of large high power semi-conductors

Details Cooling of large high power semi-conductors Cooling of large high power semi-conductors

1990-07-06

1991-03-26

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 361385, 165 803, H01L 2504, H05K 720

Patent

active

050033760

ABSTRACT:
There is disclosed a liquid cooled high power semi-conductor structure comprising multiple stacked semi-conductor devices each having at least one surface prepared with a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, there being multiple semi-conductor devices stacked with heat exchange surfaces of adjacent or semi-conductor devices opposing each other, said heat exchange surfaces being spaced apart to form a coolant conduit, the several coolant conduits being fed coolant in parallel by a common input conduit and the discharge coolant feeding in parallel into a common discharge conduit, said stacked semi-conductor devices being electrically connected in series or some combination of series parallel.

REFERENCES:
patent: 2501331 (1950-03-01), Hein
patent: 3573569 (1971-04-01), Davis
patent: 3993123 (1976-11-01), Chu et al.
patent: 4712609 (1987-12-01), Iversen

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