Cooling of electronics and high density power dissipation...

Details Cooling of electronics and high density power dissipation... Cooling of electronics and high density power dissipation...

2005-10-18

2005-10-18

Jiang, Chen Wen (Department: 3744)

Refrigeration

Structural installation

With electrical component cooling

C062S304000, C361S699000, C361S698000, C165S080400

Reexamination Certificate

active

06955063

ABSTRACT:
A cooling method and apparatus including a mist-generating device is configured to generate a mist of droplets from water, dielectric liquids or any cooling liquids. The mist is produced having such volume, momentum, concentration and quality of scale so as to deter or avoid impingement or deposition of the mist droplets on a surface to be cooled or on surfaces within a heat dissipating system to be cooled. Effective cooling is provided by the high latent heat of vaporization of water or other suitable fluid, while surfaces normally subject to possible damage by wetting are protected from harmful contact from the fluid.Tangential flow technology and electronic ultrasonic atomizing devices may be used as one possible means to generate the required mist and control mist volume, momentum, concentration and quality. Other variables may be controlled to enhance the cooling of the mist, such as flow patterns and flow directions of the mist. Vaporized mist may be condensed and recovered. The cooling method may be used to replace or complement existing air-cooled systems.

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patent: 6377453 (2002-04-01), Belady
patent: 6604370 (2003-08-01), Bash et al.

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