Cooling of a plasma electrode system for an etching apparatus

Details Cooling of a plasma electrode system for an etching apparatus Cooling of a plasma electrode system for an etching apparatus

1989-01-19

1990-10-16

Paschall, M. H.

Electric heating

Metal heating

By arc

21912141, 21912149, 219 2154, 156345, 156646, B23K 900

Patent

active

049637134

ABSTRACT:
An etching apparatus has a method for stopping the generation of plasma responsive to the detection of poor cooling of a block electrode, which is provided with an electrode, to prevent the electrode from being cracked because of the thermal expansion of both electrodes so as to reduce the times of electrode exchange. The present invention also provides an etching method including a process of controlling the flow rate and pressure of a cooling gas supplied to a clearance between a substrate to be processed and a block electrode on which the substrate is mounted, so as to enable uniform etching to be applied to the substrate.

REFERENCES:
patent: 4125754 (1978-11-01), Wasserman et al.
patent: 4367114 (1983-01-01), Steinberg et al.
patent: 4371775 (1983-02-01), Mihara et al.
patent: 4547648 (1985-10-01), Longeway
patent: 4659899 (1987-04-01), Welkic et al.
patent: 4800251 (1989-01-01), Matsuoka
IBM Technical Disclosure Bulletin, vol. 26, No. 7B, Dec. 1983.

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