Cooling multi-chip modules using embedded heat pipes

Details Cooling multi-chip modules using embedded heat pipes Cooling multi-chip modules using embedded heat pipes

1993-04-05

1994-10-18

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165 804, 174 152, 257700, H01L 23427

Patent

active

053559428

ABSTRACT:
A method and apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat away from the semiconductor chips through a heat conductive bonding layer.

REFERENCES:
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 5095404 (1992-03-01), Chao
patent: 5164541 (1992-11-01), Leyssens et al.

Affiliated with

Also associated with

Rating

Cooling multi-chip modules using embedded heat pipes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling multi-chip modules using embedded heat pipes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling multi-chip modules using embedded heat pipes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2366147