Cooling multi-chip modules using embedded heat pipes

Details Cooling multi-chip modules using embedded heat pipes Cooling multi-chip modules using embedded heat pipes

1992-10-15

1993-12-07

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 174 152, 257715, H05K 720

Patent

active

052688127

ABSTRACT:
An apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat away from the semiconductor chips through a heat conductive bonding layer.

REFERENCES:
patent: 4019098 (1977-04-01), McCready
patent: 4396936 (1983-08-01), McIver
patent: 4574879 (1986-03-01), DeGree
patent: 4630172 (1986-12-01), Stenerson
patent: 4631636 (1986-12-01), Andrews
patent: 4727455 (1988-02-01), Neidig
patent: 4748495 (1988-05-01), Kucharek
patent: 4774630 (1988-09-01), Reisman
patent: 4879629 (1989-11-01), Tustaniwskyj
patent: 4966226 (1990-10-01), Hamburgen
patent: 4982311 (1991-01-01), Dehaine
patent: 5005638 (1991-04-01), Goth
patent: 5012386 (1991-04-01), McShane
patent: 5065281 (1991-11-01), Hernandez
patent: 5095404 (1992-03-01), Chao

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