Cooling module for integrated circuit chips

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361386, H05K 720

Patent

active

045583951

ABSTRACT:
A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

REFERENCES:
patent: 3481393 (1969-12-01), Chu
patent: 4109707 (1978-08-01), Wilson
patent: 4245273 (1981-01-01), Feinbert
patent: 4381032 (1983-04-01), Cutchaw
"Silicon Heat Sink . . . ", Ahearn, IBM Tech. Discl. Bull., vol. 21, No. 8, Jan. 79, pp. 3378, 3379.

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