Cooling method and apparatus for integrated circuit chips

Details Cooling method and apparatus for integrated circuit chips Cooling method and apparatus for integrated circuit chips

1989-12-27

1990-11-06

Tapolcai, William E.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

62434, 361385, F28D 1500

Patent

active

049678329

ABSTRACT:
A method and apparatus for lowering integrated circuit chip ambient temperatures uses negative pressure to induce cooling liquid flow, rather than prior art positive pressure approaches, thereby preventing undesirable cooling liquid leakage outside of the cooling region. The cooling liquid is deaerated to eliminate performance degrading air bubbles, which are a by-product of the negative pressure approach.

REFERENCES:
patent: 2341058 (1944-02-01), Paluev
patent: 3098891 (1963-07-01), Delguste
patent: 3570762 (1971-03-01), Wanson
patent: 3817321 (1974-06-01), von Cube et al.
patent: 3989102 (1976-11-01), Jaster et al.
patent: 4302793 (1981-11-01), Rohner
patent: 4437082 (1984-03-01), Walsh et al.
patent: 4513346 (1985-04-01), Devins
patent: 4879632 (1989-11-01), Yamamoto et al.
IBM Technical Disclosure Bulletin, vol. 17, No. 3, Aug. 1974, pp. 884 & 885, "Liquid Cooled Electronic Components for Low-End Machines", Cunavellis et al.

Affiliated with

Also associated with

Rating

Cooling method and apparatus for integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling method and apparatus for integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling method and apparatus for integrated circuit chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1301787