Cooling mechanisms associated with card adapter

Details Cooling mechanisms associated with card adapter Cooling mechanisms associated with card adapter

2007-08-07

2007-08-07

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S688000, C361S689000, C361S699000, C361S715000, C361S716000

Reexamination Certificate

active

11075459

ABSTRACT:
A structure may be coupled to an adapter coupling two or more modules together. In some embodiments, the structure may direct air and/or dissipate heat from the modules into the air. The structures may direct air to components on a module that might receive less airflow without the structures. In some embodiments, the structure may be coupled to the adapter through a fastener (e.g., multiple structures may be manufactured with a plate, and the plate may be coupled to the adapter). In some embodiments, thermally conductive pathways may be used on the modules to conduct heat from components on the modules to a heat dissipating structure on the adapter.

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