Cooling means for semiconductor device

Details Cooling means for semiconductor device Cooling means for semiconductor device

1981-05-13

1983-11-22

James, Andrew J.

357 65, 357 67, 357 68, H01L 2302, H01L 2348, H01L 2946, H01L 2962

Patent

active

044172672

ABSTRACT:
A cooling means for a semiconductor device comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitting part for a semiconductor device; an alloy layer formed only at said fitting part of the heat radiating plate to allow easy soldering and a solder layer for bonding said semiconductor device to said alloy layer.

REFERENCES:
patent: 2763822 (1956-09-01), Frola et al.
patent: 3187812 (1965-06-01), Staver
patent: 3396361 (1968-08-01), Sussman
patent: 3434018 (1969-03-01), Boczar et al.
patent: 3930115 (1975-12-01), Uden et al.
patent: 4196444 (1980-04-01), Butner et al.

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