Cooling integrated circuits using a cold plate with two...

Details Cooling integrated circuits using a cold plate with two... Cooling integrated circuits using a cold plate with two...

2007-09-04

2007-09-04

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S701000, C361S710000, C361S711000, C361S718000, C257S713000, C257S714000

Reexamination Certificate

active

10876399

ABSTRACT:
A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

REFERENCES:
patent: 3561525 (1971-02-01), Baer
patent: 3980133 (1976-09-01), Mitsuoka et al.
patent: 2002/0195242 (2002-12-01), Garner
patent: 2004/0234378 (2004-11-01), Lovette et al.
patent: 2005/0205241 (2005-09-01), Goodson et al.
patent: 01121689 (1989-05-01), None

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