Cooling facility for cooling a component

Details Cooling facility for cooling a component Cooling facility for cooling a component

2009-03-10

2010-12-28

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S679480, C361S679500, C361S679540, C361S695000, C361S703000, C361S704000, C361S709000, C361S710000, C165S080300, C165S185000, C165S908000, C174S016100, C174S016300

Reexamination Certificate

active

07859842

ABSTRACT:
A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.

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