Cooling element for solder bonded semiconductor devices

Details Cooling element for solder bonded semiconductor devices Cooling element for solder bonded semiconductor devices

1981-03-30

1984-04-10

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 79, 165 80A, 174 16HS, 361389, H01L 2302, H02B 100, H05K 720, F28F 700

Patent

active

044424507

ABSTRACT:
An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being:

REFERENCES:
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patent: 3896544 (1975-07-01), Fosnough
patent: 3996604 (1976-12-01), Kimura et al.
patent: 4093971 (1978-06-01), Chu et al.
patent: 4203646 (1980-05-01), Desso et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4263965 (1981-04-01), Monsuria et al.
IBM TDB vol. 21, No. 3, Aug. 1978, p. 1141.
IBM TDB vol. 20, No. 12, May 1978, p. 5203.
IBM TDB vol. 13, No. 5, Oct. 1970, p. 1060.
IBM TDB vol. 20, No. 5, Oct. 1977, p. 1968.
Dombroski et al., "Thermal Conduction Module, " IBM Technical Disclosure Bulletin, vol. 20, No. 6, Nov. 1977.
"Semiconductor Module with Improved Air Cooling" E. E. Zirnis IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, p. 1768.

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