Cooling element for heat dissipation in electronic components

Details Cooling element for heat dissipation in electronic components Cooling element for heat dissipation in electronic components

2007-03-06

2007-03-06

Duong, Tho (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S185000, C361S688000

Reexamination Certificate

active

10863565

ABSTRACT:
A cooling element for heat dissipation in one or more electronic components includes a metal element with one or more slit-shaped receiving openings for one or more electronic components that are to be cooled. In its lengthwise extension, each receiving opening has a receiving bore that holds a helical spring and that runs parallel to the lengthwise extension. The receiving bore is arranged in such a way that it is open on the lengthwise side towards the receiving opening and the spring placed in it projects with a radial partial section into the receiving opening that holds the electronic component. As a result, in partial areas, the spring presses the electronic component against the inner wall of the receiving opening that lies opposite from the spring, thus establishing thermal contact.

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