Cooling devices for cooling electric components, module...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S713000, C165S080500, C210S090000

Reexamination Certificate

active

10515279

ABSTRACT:
At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.

REFERENCES:
patent: 5978220 (1999-11-01), Frey et al.
patent: 6014312 (2000-01-01), Schulz-Harder et al.
patent: 6839234 (2005-01-01), Niwatsukino et al.
patent: 6929739 (2005-08-01), Pohl et al.
patent: 2005/0117298 (2005-06-01), Koga et al.
patent: 3404027 (1984-08-01), None
patent: 39 40 933 (1991-06-01), None
patent: 19643717 (1998-04-01), None
patent: 197 10 783 (1998-09-01), None
patent: 199 25 510 (2000-12-01), None
patent: 0 014 249 (1980-08-01), None
patent: 0 254 692 (1988-01-01), None
patent: 0 978 874 (2000-02-01), None
Schulz-Harder et al., “Directionally bent Alumina DBC Substrates”, Proceedings of the 12th European Microelectronics & Packaging Conference, 1999, pp. 489-493.
Exel et al., “Water cooled DBC Direct Bonded Copper Substrates”, Proceedings of the 24th Annual Conference of the IEEE, 1998, pp. 2350-2354.
Schulz-Harder, J., “DBC Substrates as a Base for Power MCM's”, Proceedings of the 2000 Electronics Packaging Conference, 2000, pp. 315-320.

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