Cooling device with thermally separated electronic parts on a mo

Details Cooling device with thermally separated electronic parts on a mo Cooling device with thermally separated electronic parts on a mo

1996-11-19

1998-08-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 361719, H05K 720

Patent

active

057936110

ABSTRACT:
An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.

REFERENCES:
patent: 4204246 (1980-05-01), Arii
patent: 4327399 (1982-04-01), Sasaki
patent: 4858073 (1989-08-01), Gregory
patent: 4859520 (1989-08-01), Dubuisson
patent: 4970868 (1990-11-01), Grebe
patent: 5172301 (1992-12-01), Schneider
patent: 5216580 (1993-06-01), Davidson
patent: 5280409 (1994-01-01), Selna
patent: 5283715 (1994-02-01), Carlsten
patent: 5331510 (1994-07-01), Ouchi
patent: 5352991 (1994-10-01), Lipschultz
patent: 5386143 (1995-01-01), Fitch
patent: 5475263 (1995-12-01), Coady
Two-Phase Thermosyphon Cooling For Telecom Multichip Modules, Tohru Kishimoto and Akio Harada, Advances in Electronic Packaging, ASME 1992, pp. 135-141.

Affiliated with

Also associated with

Rating

Cooling device with thermally separated electronic parts on a mo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling device with thermally separated electronic parts on a mo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device with thermally separated electronic parts on a mo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-395514