Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Patent
1998-02-13
2000-07-04
Lazarus, Ira S.
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
16510433, 16510421, 174 152, 361704, 257715, F28D 1500
Patent
active
060824433
ABSTRACT:
The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.
REFERENCES:
patent: 4046190 (1977-09-01), Marcus et al.
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4461343 (1984-07-01), Token et al.
patent: 4674565 (1987-06-01), Beam
patent: 4697205 (1987-09-01), Eastman
patent: 4715430 (1987-12-01), Arnold et al.
patent: 4805691 (1989-02-01), Cook et al.
patent: 4840224 (1989-06-01), Dietzsch
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5183104 (1993-02-01), Novotny
patent: 5308920 (1994-05-01), Itoh
patent: 5309986 (1994-05-01), Itoh
patent: 5458189 (1995-10-01), Larson et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5560423 (1996-10-01), Larson et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
patent: 5713413 (1998-02-01), Osakabe et al.
patent: 5727619 (1998-03-01), Yao et al.
patent: 5769154 (1998-06-01), Adkins et al.
IBM Technical Disclosure Bulletin, R. J. Dombrowskas et al. p. 442, Jul. 1970.
Ikeda Masami
Niekawa Jun
Sasaki Ken
Ueki Tatuhiko
Yamamoto Masaaki
Lazarus Ira S.
McKinnon Terrell
The Furukawa Electric Co. Ltd.
LandOfFree
Cooling device with heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device with heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device with heat pipe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1477579